Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Steve Woo, distinguished inventor and fellow at Rambus, examines the benefits of a common substrate for communication, the ...

The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with ...

A new technical paper titled “SRAM and Mixed-Signal Logic With Noise Immunity in 3nm Nano-Sheet Technology” was published by ...

A new technical paper titled “Modular Compilation for Quantum Chiplet Architectures” was published by researchers at ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Trump's tech stamp; Chiplet Summit announcements; AI diffusion export concerns; Cadence's security acquisition; chiplets; UMC ...

A new technical paper titled “Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

The path to fully autonomous vehicles may be clear in concept, but fully realizing that development environment is another ...