TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...
Taiwan Semiconductor Manufacturing Company (TSMC) has received government approval to manufacture chips using its upcoming 2nm-class process technologies at facilities outside of Taiwan ...
That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance ...
Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) quarterly sales topped estimates ... s largest company bolsters expectations that big tech companies from Alphabet Inc to Microsoft Corp would ...
In brief: The Taiwanese government is lifting restrictions that prevented TSMC from building cutting ... on the types of facilities they could build abroad – particularly in China – to ...
Apple chipmaker TSMC is currently building its third US-based ... Thus, despite the $65 billion the company is investing to build its three Arizona factories, it sounds like those shiny new ...